View CSPEMI307AG_1229132.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

CSPEMI307A 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB
Features
* * * * * * Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection EMI/ESD channels provide greater than 32dB attenuation at 1GHz +15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) + 30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available
Product Description
The CSPEMI307A is a multichannel EMI/ESD array offering a combination of four low-pass filter + ESD channels to reduce EMI/RFI emissions on a data port and four dedicated ESD-only channels intended specifically for ESD protection on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a data port connector. The CSPEMI307A provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CSPEMI307A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI307A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
* *
Applications
* * * * * * * EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs
Electrical Schematic
100 FILTER+ESDn* 30pF 30pF FILTER+ESDn* ESDn* 30pF
GND (Pins B1-B3)
1 of 4 EMI/RFI + ESD Channels.
* See Package/Pinout Diagram for expanded pin information
1 of 4 ESD-only Channels
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
1
CSPEMI307A
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
Orientation Marking (see note 2)
BOTTOM VIEW
(Bumps Up View)
(Bumps Down View)
1 A B C
2
3
4
5
6
ESD_3 FILTER/ESD_2 FILTER/ESD_4
C1
C2
FILTER/ESD_1
C3
GND
C4
FILTER/ESD_3
C5
GND
C6
ESD_4
307A
GND
B1 A2
FILTER/ESD_1
B2 A4
FILTER/ESD_3
B3 A6
ESD_2
Orientation Marking
ESD_1
FILTER/ESD_2
FILTER/ESD_4
A1
A1
A3
A5
CSPEMI307A CSP Package Notes:. 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD_1 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_2 GND ESD_3 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Bumps 15 Package CSP Number1 CSPEMI307A Part Marking 307A Lead-free Finish 2 Ordering Part Number1 CSPEMI307AG Part Marking 307A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 At 2.5V DC IDIODE=10A VDIODE=3.3V ILOAD = 10mA 5.6 -0.4 Notes 2,4 and 5 30 15 Notes 2,3,4 and 5 +10 -5 R = 100, C = 30pF 64 V V MHz kV kV 6.8 -0.8 9.0 -1.5 V V 5.5 100 At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 MAX 120 36 UNITS pF ppm/C ppm/C V nA
VESD
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
(c) 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2)
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
5
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25C, 50 Ohm Environment)
Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias
(c) 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Performance Information (cont'd)
1.6
1.5
1.4
Normalized Capacitance
1.3
1.2
T = -40C T = +25C T = +70C
1.1
1.0
0.9
0.8
0.7 0 1 2 3 4 5
DC Input Voltage (V)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
1.100 1.080 1.060
Nornalized Resistance
1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C]
Figure 7. Resistance vs. Temperature (normalized to resistance at 25C)
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
7
CSPEMI307A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2003 California Micro Devices Corp. All rights reserved.
Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/10/03
CSPEMI307A
Mechanical Details
CSP Mechanical Specifications CSPEMI307A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C A2 C2 B B2 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.561 0.355 Nom 2.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.605 0.380 Max 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.649 0.405 Min Custom CSP 15 Inches Nom Max 0.1148 0.1165 0.1183 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.0091 0.0110 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
A 1 2 3 4 5 6 D1 D2
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI307A Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CSPEMI307A CHIP SIZE (mm) 2.96 X 1.33 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W
Ko
Bo
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 11. Tape and Reel Mechanical Data
(c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
9

▲Up To Search▲

Price & Availability of CSPEMI307AG

	To Download CSPEMI307AG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .